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SZ CnAuto automation equipment Co., Ltd.

Specializing in the production of automatic\precision\high speed dispenser manufacturers

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18929475867

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18929475867

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ADD:东莞市塘厦镇石潭浦大迳路62号

IC Chip Packaging Requirements Application Automation Equipm

编辑:点胶机发布员???日期:2019-11-13 09:23???浏览:

Integrated circuit is short for integrated circuit or integrated circuit IC chip. It is a kind of micro-electronic equipment or components. It uses specific processes to interconnect transistors, diodes, resistors, capacitors, inductors and other components and wiring needed in circuits. The packaging, dispensing and welding of integrated circuit IC chip can be used. Automatic equipment with corresponding functions is used to complete, instead of manual inefficient operation.
 
Full automatic dispensing machine for dispensing IC chip packaging needs relatively high precision, because the precision of IC chip components is relatively high, automatic dispensing equipment is specially used for dispensing packaging of high-precision electronic components of electronic equipment.
电路板涂胶
IC chip packaging dispenser equipment is usually used on circuit boards. First, high-precision solder paste is used for spot welding. The packaging process of IC chips is accomplished quickly through the application of special automatic glue coating machine.
 
芯片封装 According to the precision requirement of high integrated circuit chip and high glue point, the automatic glue coating machine adopts high precision dispensing configuration, and the charge coupled device can locate the mark point intelligently by vision. The IC chip package can be completed without fixing the product with precise fixture.
 
Equipped with high-speed injection valve, it can solve the application of medium and high viscosity slurry, and can be used for solder paste, silver slurry, high viscosity glue, etc.
芯片涂胶 自动涂胶机
Non-contact dispensing is used to avoid damage to precision components, and dispensing accuracy and speed are higher than other valves. It is a high-quality dispensing device, suitable for higher IC chip packaging requirements.
 


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